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首页> 外文期刊>Journal of Laser Micro/Nanoengineering >Laser Alloying Nickel on 4H-Silicon Carbide Substrate to Generate Ohmic Contacts
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Laser Alloying Nickel on 4H-Silicon Carbide Substrate to Generate Ohmic Contacts

机译:在4H-碳化硅衬底上激光合金化镍以产生欧姆接触

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To obtain ohmic contacts on silicon carbide semicondanneuctors commonly a thin metal layer is deposited onto the semiconductor wafer, followed by a rapid thermal process to transform the result-ing Schottky diode into an ohmic contact. Here, we report on an alternative laser based process re-placing the conventional rapid thermal treatment. A continuous wave infrared fiber laser is em-ployed to locally alloy nickel coated silicon carbide to an ohmic contact. Our results show that ohm-ic contacts are achieved with laser powers between 100 W and 300 W over an irradiated area on the order of 7 mm diameter. Electrical resistances of the generated ohmic contacts are measured down to 6.5 Ω, depending on laser power. Temperature dependent measurements of the resistance reveal a negative temperature coefficient of 11 mΩ/K.
机译:为了在碳化硅半导体装置上获得欧姆接触,通常在半导体晶片上沉积一层薄金属层,然后进行快速热处理以将生成的肖特基二极管转换为欧姆接触。在这里,我们报道了替代传统的快速热处理的基于激光的替代工艺。使用连续波红外光纤激光器将镍镀镍的碳化硅局部合金化为欧姆接触。我们的结果表明,在直径为7 mm的辐照区域上,使用100 W至300 W之间的激光功率可以实现欧姆接触。根据激光功率的不同,所产生的欧姆触点的电阻低至6.5Ω。电阻的温度相关测量显示负温度系数为11mΩ/ K。

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