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首页> 外文期刊>Journal of Green Engineering >Towards a Multi-scale Approach to the Simulation of Silicon Hetero-junction Solar Cells
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Towards a Multi-scale Approach to the Simulation of Silicon Hetero-junction Solar Cells

机译:迈向硅异质结太阳能电池仿真的多尺度方法

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The silicon hetero-junction (SHJ) technology holds the current efficiency record of 25.6% for silicon-based single junction solar cells and shows great potential to become a future industrial standard for high-efficiency crystalline silicon (c-Si) cells. One of the main advantages of this concept over other wafer based silicon technologies are the very high open-circuit voltages that can be achieved thanks to the passivation of contacts by thin films of hydrogenated amorphous silicon (a-Si:H). The a-Si:H/c-Si interface, while central to the technology, is still not fully understood in terms of transport and recombination across this nanoscale region, especially concerning the role of the different localized tail and defect states in the a-Si:H and at the a-Si:H/c-Si interface and of the band offsets and band bending induced by the heterostructure potential and the large doping, respectively. For instance, a consistent microscopic picture of transport and recombination processes with treatment of thermal and tunneling mechanisms on equal footing is lacking. On the other hand, there are new SHJ device architectures like thin wafers with light trapping structures [1] or interdigitated back contact (IBC) cells [2], which define additional requirements for the modelling approach concerning the integration of 3D optical and electrical simulations. This paper provides an overview over our current efforts in the creation of a multi-scale and multi-physics framework to deal with the challenges encountered in the simulation of SHJ solar cells.
机译:硅异质结(SHJ)技术保持了基于硅的单结太阳能电池的25.6%的当前效率记录,并显示出成为成为高效率晶体硅(c-Si)电池的未来工业标准的巨大潜力。与其他基于晶圆的硅技术相比,该概念的主要优势之一是非常高的开路电压,这是由于氢化非晶硅(a-Si:H)薄膜对触点进行钝化而实现的。 a-Si:H / c-Si界面虽然是该技术的核心,但在跨纳米区域的运输和重组方面,尤其是在a-Si中不同的局部尾巴和缺陷状态的作用方面,仍未被完全理解。 Si:H和在a-Si:H / c-Si界面处,以及由异质结构势和大掺杂引起的能带偏移和能带弯曲。例如,缺乏在相同基础上对热和隧穿机制进行处理的运输和重组过程的一致微观图像。另一方面,出现了新的SHJ器件架构,例如具有光捕获结构的薄晶圆[1]或指指背接触(IBC)单元[2],它们为有关3D光学和电气仿真集成的建模方法定义了其他要求。本文概述了我们当前在创建多尺度和多物理框架以应对SHJ太阳能电池模拟中遇到的挑战方面所做的努力。

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