首页> 外文会议>Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE >Interdigitated back contact silicon hetero-junction solar cells: The effect of doped layer defect levels and rear surface i-layer band gap on fill factor using two-dimensional simulations
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Interdigitated back contact silicon hetero-junction solar cells: The effect of doped layer defect levels and rear surface i-layer band gap on fill factor using two-dimensional simulations

机译:叉指背接触式硅异质结太阳能电池:使用二维模拟,掺杂层缺陷水平和背面i层带隙对填充因子的影响

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Interdigitated back contact silicon hetero-junction (IBC-SHJ) solar cells using a-Si emitter and contact layers show significant potential advantages over standard hetero-junction devices: higher short-circuit current (Jsc) since there is no grid shading and higher open-circuit voltage (Voc) due to better surface passivation. However, they often suffer from low fill factor (FF). Using two-dimensional simulations to model IBC-SHJ devices on FZ n-Si, we found that the FF was nearly independent of the defect concentrations in contact and passivating i-layers but strongly dependent on the defects in emitter and the band gap in the rear i-layer. Voc and Jsc were nearly independent of defects in either doped layer. In a-Si doped layers it is well known that the number of defects increase with doping. We find that the FF is sensitive to either mid-gap or band tail states and that S-shaped JV curves responsible for low FF can be eliminated by a decrease in p-layer mid-gap or band tail defect levels, or by decreasing the rear i-layer's band gap. The insensitivity of FF to defects in the n-layer or in the i-layer suggests the FF is dominated by minority carrier injection/collection from the p-type emitter layer. The dependence of FF on the rear i-layer band gap suggests that increasing the offset in the valence band impedes minority carrier collection.
机译:使用a-Si发射极和接触层的叉指背接触式硅异质结(IBC-SHJ)太阳能电池与标准异质结器件相比具有显着的潜在优势:由于没有栅极阴影和较高的开路,因此具有较高的短路电流(Jsc) -电路电压(Voc)归因于更好的表面钝化。但是,它们通常遭受填充系数(FF)低的困扰。使用二维模拟对FZ n-Si上的IBC-SHJ器件进行建模,我们发现FF几乎与接触和钝化i层中的缺陷浓度无关,而在很大程度上取决于发射极中的缺陷和半导体中的带隙后i层。 Voc和Jsc几乎与任一掺杂层中的缺陷无关。众所周知,在非晶硅掺杂层中,缺陷的数量随掺杂而增加。我们发现FF对中间间隙或带尾状态很敏感,并且可以通过降低p层中间间隙或带尾缺陷水平或减小F来消除造成低FF的S形JV曲线。后i层的带隙。 FF对n层或i层中的缺陷不敏感,表明FF主要由少数载流子从p型发射极层注入/收集​​而来。 FF对后i层带隙的依赖性表明,价带偏移的增加会阻碍少数载流子的收集。

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