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Correlation between Oxide Breakdown Field and Effective Oxide Charge Concentration in Ultra-Thin Tunnel Oxide of FG Flash Memory

机译:FG闪存超薄隧道氧化物中氧化物击穿场与有效氧化物电荷浓度的相关性

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Experiments were carried-out to study the relationship between the oxide breakdown field of thin silicon dioxide (SiO2) film, and the effective oxide charges concentration, NEFF. The Metal-Oxide-Semiconductor (MOS) capacitors were used as the test vehicle where standard MOS fabrication process technologies were employed. The main device fabrication processes involved were dry thermal oxidation, photolithography, etching and metallization. After the final sintering process, the electrical device characterization namely the Current-Voltage (I-V) and Capacitance-Voltage (C-V) was carried out on MOS capacitor test structures. The result shows that the oxide's breakdown field is significantly correlated with the amount of the effective oxide charge for the whole studiedthickness range. The breakdown field also exhibited power-law dependency on the oxide thickness. Therefore, it can be qualitatively concluded that the amount of trapped charge in SiO2 would promote the trap-assisted tunneling component and subsequently, causing an oxide breakdown.
机译:进行了实验,以研究二氧化硅(SiO2)薄膜的氧化物击穿场与有效氧化物电荷浓度NEFF之间的关系。金属氧化物半导体(MOS)电容器用作测试工具,其中采用了标准MOS制造工艺技术。涉及的主要器件制造工艺是干热氧化,光刻,蚀刻和金属化。在最后的烧结过程之后,在MOS电容器测试结构上进行了电气器件表征,即电流-电压(I-V)和电容-电压(C-V)。结果表明,在整个研究厚度范围内,氧化物的击穿场与有效氧化物电荷量显着相关。击穿场也表现出对氧化物厚度的幂律依赖性。因此,可以定性地得出结论,SiO2中捕获的电荷量将促进陷阱辅助的隧穿成分,并随后导致氧化物击穿。

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