Evaluation of Copper Oxide-Based Interconnecting Materials

摘要

Copper (I) oxide (Cu2O) and copper (II) oxide (Cu2O2) were investigated for their bondability as aninterconnecting material. It was found that copper (II) oxide is more suitable than copper (I) oxide because the former isreduced at a lower temperature (345°C) when molecular hydrogen is used as a reducing agent. A combined analysis oftheoretically-calculated reduction paths, thermogravimetric/differential thermal analysis (TG-DTA) curves, and shear testresults revealed that lower activation energy and higher stabilization energy for the reduction contribute to bettermechanical and thermal properties of an interconnection.