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Dynamic Predictive Modeling of Solder Paste Volume with Real Time Memory Update in a Stencil Printing Process

机译:模板印刷过程中具有实时内存更新的焊锡膏量的动态预测建模

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This research aims to develop a dynamic prediction model to assist real-time decision making of a stencil printing process by maintaining high prediction accuracy of the printing process. In a Surface Mount Technology (SMT) assembly line, the stencil printing process (SPP) accounts for more than 50% of the defectiveness of printed circuit boards (PCBs). During the printing process, environmental changes such as humidity or wear of blades may induce the PCBs printing results to deviate from the target volume. Thus, real-time adjustment of the printer settings (e.g., printing parameters, clean cycles, etc.) based on prediction of printing volumes is critical to maintain a high printing performance. However, research has been limited in real time SPP control, which is partially due to the difficulties in predicting the paste volumes with high accuracy and time efficiency. To tackle the challenges, this research proposes novel online learning models for real-time SPP status prediction. The prediction model is implemented by selecting advanced online learning models to estimate the printing volumes in averages and standard deviations (SDs) considering different pad sizes with different clean ages, directions, printer parameters, etc. The model performances are evaluated in Root Mean Square Error (RMS E),R2, etc. From comparison, the Support Vector Regressor (SVR) shows outstanding prediction performance withR2values of 92% and 81% for volume averages and SDs. This research emphasizes the potential of using online learning as a preliminary process for effective real-scenario SMT assembly dynamic control.
机译:这项研究旨在开发一种动态预测模型,以通过保持印刷过程的高预测精度来辅助模板印刷过程的实时决策。在表面贴装技术(SMT)装配线中,模版印刷工艺(SPP)占印刷电路板(PCB)缺陷的50%以上。在打印过程中,环境变化(例如湿度或刀片磨损)可能会导致PCBs的打印结果偏离目标体积。因此,基于打印量的预测来实时调整打印机设置(例如,打印参数,清洁周期等)对于维持高打印性能至关重要。但是,实时SPP控制的研究受到限制,部分原因是难以以高精度和高时间效率预测焊膏量。为了解决这些挑战,本研究提出了新颖的在线学习模型,用于实时SPP状态预测。通过选择高级在线学习模型来实现预测模型,以考虑具有不同清洁年龄,方向,打印机参数等的不同垫尺寸来估计平均值和标准偏差(SD)的打印量。该模型的性能以均方根误差进行评估(RMS E),R2等。通过比较,支持向量回归(SVR)显示出出色的预测性能,对于体积平均值和SD,R2值分别为92%和81%。这项研究强调了在线学习作为有效的实际场景SMT装配动态控制的初步过程的潜力。

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