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首页> 外文期刊>Nanoscale Research Letters >Leakage Current Mechanism of InN-Based Metal-Insulator-Semiconductor Structures with Al2O3 as Dielectric Layers
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Leakage Current Mechanism of InN-Based Metal-Insulator-Semiconductor Structures with Al2O3 as Dielectric Layers

机译:以Al 2 O 3 为介质层的InN基金属-绝缘体-半导体结构的漏电流机理

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InN-based metal-insulator-semiconductor (MIS) structures were prepared with Al~(2)O~(3) as the gate oxides. Surface morphologies of InN films are improved with increasing Mg doping concentrations. At high frequencies, the measured capacitance densities deviate from the real ones with turning frequencies inversely proportional to series resistances. An ultralow leakage current density of 1.35?×?10_(?9)?A/cm_(2) at 1?V is obtained. Fowler-Nordheim tunneling is the main mechanism of the leakage current at high fields, while Schottky emission dominates at low fields. Capacitance densities shift with different biases, indicating that the InN-based MIS structures can serve as potential candidates for MIS field-effect transistors.
机译:以Al〜(2)O〜(3)为栅氧化物制备了InN基金属绝缘体半导体(MIS)结构。 InN薄膜的表面形貌随Mg掺杂浓度的增加而改善。在高频下,测得的电容密度与实际电容密度有偏差,其转折频率与串联电阻成反比。在1?V下获得1.35?×?10 _(?9)?A / cm_(2)的超低漏电流密度。 Fowler-Nordheim隧穿是高场漏电流的主要机制,而肖特基发射在低场占主导。电容密度随着不同的偏置而变化,这表明基于InN的MIS结构可以作为MIS场效应晶体管的潜在候选者。

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