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首页> 外文期刊>Nanoscale Research Letters >Dielectric Enhancement of Atomic Layer-Deposited Al 2O 3/ZrO 2/Al 2O 3 MIM Capacitors by Microwave Annealing
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Dielectric Enhancement of Atomic Layer-Deposited Al 2O 3/ZrO 2/Al 2O 3 MIM Capacitors by Microwave Annealing

机译:原子层沉积Al 2 O 3 / ZrO 2 / Al 2 O 3的介电增强微波退火MIM电容器

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摘要

For metal-insulator-metal (MIM) capacitors applicated in the fields of RF, DRAM, and analog/mixed-signal integrated circuits, a high capacitance density is imperative with the downscaling of the device feature size. In this work, the microwave annealing technique is investigated to enhance the dielectric characteristics of Al~(2)O~(3)/ZrO~(2)/Al~(2)O~(3)based MIM capacitors. The results show that the permittivity of ZrO~(2)is increased to 41.9 (~?40% enhanced) with a microwave annealing at 1400?W for 5?min. The substrate temperature is lower than 400?°C, which is compatible with the back end of line process. The leakage current densities are 1.23?×?10_(?8)and 1.36?×?10_(?8)?A/cm_(2)for as-deposited sample and 1400?W sample, respectively, indicating that the leakage property is not deteriorated. The conduction mechanism is confirmed as field-assisted tunneling.
机译:对于RF,DRAM和模拟/混合信号集成电路领域中应用的金属-绝缘体-金属(MIM)电容器,随着器件特征尺寸的减小,必须具有高电容密度。在这项工作中,研究了微波退火技术以增强基于Al〜(2)O〜(3)/ ZrO〜(2)/ Al〜(2)O〜(3)的MIM电容器的介电特性。结果表明,在1400?W微波退火5?min的条件下,ZrO〜(2)的介电常数提高到41.9(〜40%提高)。基板温度低于400°C,这与流水线工艺的后端兼容。对于沉积样品和1400W样品,泄漏电流密度分别为1.23Ω×Ω10_(Ω8)和1.36Ω×Ω10_(Ω8)ΩA/ cm_(2),表明泄漏性能为没有恶化。传导机制被确认为场辅助隧穿。

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