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Influence of mechanical stress in semiconductor heterostructure on density of p–n-junctions

机译:半导体异质结构中的机械应力对p–n结密度的影响

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It has been recently shown that inhomogeneity of semiconductor heterostructure and optimization of annealing time leads to decrease depth of p – n -junctions and to increased homogeneity of dopant distribution in doped area. It has been also recently shown that mechanical stress in two-layer heterostructure (substrate and epitaxial layer) changes dopant distribution in heterostructure in directions, which are perpendicular to interface between layers of heterostructure, in comparison with unstressed sample. In this paper we consider an alternative approach to increase density of p – n -junctions in the same heterostructure by using overlayer. The overlayer leads to additional mechanical stress. The stress gives us possibility to increase density of p – n -junctions in the heterostructure.
机译:最近的研究表明,半导体异质结构的不均匀性和退火时间的优化导致p-n结深度的减小以及掺杂区掺杂物分布的均匀性的提高。最近还显示,与无应力样品相比,两层异质结构(衬底和外延层)中的机械应力会改变异质结构中掺杂剂的分布方向,该方向垂直于异质结构层之间的界面。在本文中,我们考虑使用覆盖层来增加同一异质结构中p-n结密度的另一种方法。覆盖层导致额外的机械应力。应力使我们有可能增加异质结构中p-n结的密度。

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