Multilayer ceramic capacitors designed to be embedded in a lowtemperature co-fired ceramic substrate have been successfullyfabricated. Low and high value capacitors were respectivelyembedded in the lowKmultilayer substrate and highKdielectriclayer. The buried capacitor has a capacitance density range (1kHz) from about 220 pF/cm2to 30 nF/cm2. The design tookmaterial compatibility and shrinkage characteristics specificallyinto account. The effects of heating rate and peak temperatureholding time on the densification of the laminate were studied.The scanning electron micrograph revealed no evident cracking inthe fired components. The electrical properties of the buriedcapacitors such as dissipation factor, insulation resistance andbreakdown voltage were studied and found to be good for deviceapplication. The temperature dependence of the dissipation factorand coefficient of capacitance for the buried capacitor was alsostudied.
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