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Inkjet-Printed Chemical Solution Y2O3 Layers for Planarization of Technical Substrates

机译:喷墨印刷的化学溶液Y2O3层,用于技术基材的平面化

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The implementation of the Chemical Solution Deposition (CSD) methodology with the Drop on Demand (DoD) inkjet printing (IJP) technology has been successfully employed to develop a Solution Deposition Planarization (SDP) method. We have used nanocrystalline yttrium oxide (Y2O3) to decrease the roughness of technical metallic substrates by filling the surface imperfections and thus avoiding costly polishing steps. This alternative process represents an outstanding methodology to reduce the final cost of the second-generation coated conductors manufacturing. Two Y2O3 metalorganic precursor ink formulations were successfully developed and tested to obtain surfaces as smooth as possible with adequate mechanical properties to hold the internal stress developed during the growth of the subsequent layers. By using these inks as precursors for IJP and after a proper tuning of the rheological and wetting parameters, we firstly obtained centimeter length uniform 100 nm-thick SDP-Y2O3 films on unpolished stainless-steel substrate from Bruker HTS. The scalability of the roll to roll (R2R)-IJP process to 100 m is then demonstrated on metallic substrates as well. A complete characterization of the prepared SDP-Y2O3 inkjet-printed layers was carried out using optical microscopy, FIB-SEM (Focus Ion Beam coupled to Scanning Electron Microscopy), XRD (X-ray Diffraction), AFM (Atomic Force Microscopy), reflectometry and nanoindentation techniques. Then, the morphology, thickness, crystallinity and mechanical properties were evaluated, together with the surface roughness in order to assess the resulting layer planarity. The impact of planarity was additionally studied via growth of biaxially textured buffer layers as well as further functional layers. 1.1 μm-thick YSZ layers with in-plane textures better than the stainless steel (SS) polished reference were successfully deposited on top of 100 nm SDP-Y2O3 films yielding 50% of Ic in contrast to the standard SS reference.
机译:化学溶液沉积(CSD)方法与按需滴(DoD)喷墨印刷(IJP)技术的实施已成功用于开发溶液沉积平坦化(SDP)方法。我们已经使用纳米晶氧化钇(Y2O3)通过填充表面缺陷来减少工业金属基材的粗糙度,从而避免了昂贵的抛光步骤。这种替代方法代表了一种出色的方法,可以降低第二代涂层导体制造的最终成本。成功开发和测试了两种Y2O3金属有机前体油墨配方,以获得具有足够机械性能的尽可能光滑的表面,以保持在后续层的生长过程中产生的内部应力。通过将这些油墨用作IJP的前体,并在适当调整流变学和润湿参数之后,我们首先在来自Bruker HTS的未抛光不锈钢基底上获得了厘米长,均匀的100 nm厚的SDP-Y2O3膜。然后,在金属基材上也证明了卷对卷(R2R)-IJP工艺可扩展至100 m。使用光学显微镜,FIB-SEM(聚焦离子束与扫描电子显微镜),XRD(X射线衍射),AFM(原子力显微镜),反射仪对所制备的SDP-Y2O3喷墨印刷层进行了完整的表征。和纳米压痕技术。然后,评估其形态,厚度,结晶度和机械性能,以及表面粗糙度,以评估所得层的平面度。通过双轴织构缓冲层以及其他功能层的生长,还研究了平面度的影响。在100 nm SDP-Y2O3薄膜的顶部成功沉积了1.1微米厚的YSZ层,具有比不锈钢(SS)抛光参考更好的平面纹理,与标准SS参考相比产生了50%的Ic。

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