Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration

摘要

Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University