Processing of wood-derived copper-silicon carbide composites via electrodeposition

摘要

An electrodeposition technique has been adapted to produce copper-silicon carbide composites with honeycomb-like microstructures. The detrimental Cu-SiC reaction was avoided by using this room temperature processing technique. The wood-derived silicon carbide phase allows for tailorable microstructures due to the variety of available wood precursors. Plating efficiency for each wood type was determined using image analysis. This processing method results in the successful filling of pores with aspect ratios of up to 100.