Remaining-Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression

摘要

Solder joints are among the most common failure sites in electronic assemblies. This paper presents a prognostic approach that allows for the remaining useful life prediction of solder joints using an RF impedance analysis and the Gaussian process (GP) regression. While the solder joints were exposed to a mechanical stress condition to generate fatigue failures, the RF impedance of the solder joint was continuously monitored. The RF impedance provided an early indication of the impending solder-joint failure in the form of a gradual increase prior to the end of life. A GP model was applied to the RF impedance obtained from the fatigue tests in order to estimate the remaining life of the solder joint in real time. It was demonstrated that the GP model successfully predicted the time to failure of the solder joint with high accuracy prior to failure. The prediction performance was also evaluated using prognostic metrics.