SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring

Jiayun Feng; Di Erick Xu; Yanhong Tian; Michael Mayer

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SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring

机译：SAC305回流焊：使用过程中电阻监测识别熔化和凝固

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The proper control of solder heating and melting leads to successful joining of surface-mount technology devices to the metallization of printed circuit boards. When developing new solder alloys for more miniaturized and lower temperature processes, the i

机译：正确控制焊料的加热和熔化可以成功地将表面贴装技术设备连接到印刷电路板的金属上。当开发用于更小型化和更低温度工艺的新型焊料合金时，

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来源
《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 |2019年第8期|1623-1631|共9页
作者
Jiayun Feng; Di Erick Xu; Yanhong Tian; Michael Mayer;
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作者单位

Department of Mechanical and Mechatronics Engineering Microjoining Laboratory Centre for Advanced Materials Joining University of Waterloo Waterloo ON Canada;

Department of Mechanical and Mechatronics Engineering Microjoining Laboratory Centre for;

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原文格式 PDF
正文语种 eng
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关键词
Resistance; Soldering; Temperature measurement; Resistors; Monitoring; Electrical resistance measurement; Real-time systems;

机译：抵抗性;焊接;温度测量;电阻;监控;电阻测量;实时系统;

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1. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows [J] . Reeve Kathlene N., Choquette Stephanie M., Anderson Iver E., Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science . 2016,第12期

机译：Sn-Cu-Al合金的快速凝固，用于高可靠性，无铅焊料：第二部分。多次回流后迅速凝固焊料的金属间粗化行为
2. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows [J] . Reeve Kathlene N., Choquette Stephanie M., Anderson Iver E., Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science . 2016,第12期

机译：Sn-Cu-Al合金的快速凝固以实现高可靠性，无铅焊料：第二部分。多次回流后快速凝固焊料的金属间粗化行为
3. Effect of Multiple Reflow Cycles and Al 2O 3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy [J] . Sanjay Tikale, K. Narayan Prabhu Journal of Materials Engineering and Performance . 2018,第6期

机译：多重回流循环和Al <下标> 2 O <下标> 3 纳米粒子增强对SAC305无铅焊料合金的性能的影响
4. Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000g [C] . Pradeep Lall, Tony Thomas, Ken Blecker IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems . 2020

机译：冲击载荷高达10,000g时，SAC305焊料PCB的运行状况监视和故障特征识别
5. Solder wicking in surface mount vapor phase reflow soldering [D] . Abtew, Mulugeta Demelew 1993

机译：表面安装气相回流焊接中的焊锡芯吸
6. 3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity [O] . Youjin Kim, Jooheon Kim 2020

机译：3D通过SAC305焊料合金的聚结行为在环氧复合材料中互连氮化硼网络作为增强导热率的桥接材料
7. Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle [O] . Chen Guang, Liu Li, Silberschmidt Vadim V., 2016

机译：SAC305复合焊点中钢筋的保留率：钢筋类型，加工和回流周期的影响

SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring

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