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Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle

机译：SAC305复合焊点中钢筋的保留率：钢筋类型，加工和回流周期的影响

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摘要

This paper was accepted for publication in the journal Soldering and Surface Mount Technology and the definitive published version is available at http://dx.doi.org/10.1108/SSMT-02-2016-0004

机译：本文已被接受在《焊接和表面贴装技术》杂志上发表，并且可以在http://dx.doi.org/10.1108/SSMT-02-2016-0004上获得权威的出版版本。

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Chen Guang; Liu Li; Silberschmidt Vadim V.; Chan Y.C.; Liu Changqing; Wu Fengshun;
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年度 2016
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正文语种 en
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专利

1. Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle [J] . Chen Guang, Liu Li, Silberschmidt Vadim V., Soldering & Surface Mount Technology . 2016,第3期

机译：SAC305复合焊点中钢筋的保留率：钢筋类型，加工和回流周期的影响
2. Effect of Multiple Reflow Cycles and Al 2O 3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy [J] . Sanjay Tikale, K. Narayan Prabhu Journal of Materials Engineering and Performance . 2018,第6期

机译：多重回流循环和Al <下标> 2 O <下标> 3 纳米粒子增强对SAC305无铅焊料合金的性能的影响
3. Effects of diamond nanoparticles reinforcement into lead-free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process [J] . Srivalli Chellvarajoo, M.Z. Abdullah, C.Y. Khor Materials & design . 2015,第OCTa5期

机译：金刚石纳米颗粒增强无铅Sn-3.0Ag-0.5Cu焊膏对回流焊后的组织和力学性能的影响
4. Wettability and Shear Strength of SAC305 Based Composite Solder with co-doping X (Ni or Al2O3) and CNTs Reinforcements [C] . Liping Mo, Sicong Hu, Zheng Zhou, International Conference on Electronic Packaging Technology . 2018

机译：共掺杂X（Ni或Al 2 O 3 ）和CNTs增强的SAC305基复合焊料的润湿性和剪切强度
5. Effect of processing parameters and matrix shrinkage on porosity formation during synthesis of metal matrix composites with dual-scale fiber reinforcements using pressure infiltration process [D] . Etemadi, Reihaneh. 2014

机译：用压力渗透过程对金属基复合材料合成金属基复合材料孔隙率形成的影响
6. 3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity [O] . Youjin Kim, Jooheon Kim 2020

机译：3D通过SAC305焊料合金的聚结行为在环氧复合材料中互连氮化硼网络作为增强导热率的桥接材料
7. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging [O] . Liu Yang, Meerwijk Joost, Luo Liangliang, 2014

机译：回流和时效后，SAC305 / Ag / Cu和SAC0705-Bi-Ni / Ag / Cu焊点界面处金属间层结构的形成和演变

Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle

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