Impact of Soldering Atmosphere on Solder Joint Formation

摘要

Soldering atmosphere influences final solder interconnect formation. Based on previous studies, SnPb and Pb-free solders perform differently under varying soldering atmospheres. Pb-free pastes' significant reductive influence on wetting and spreading may mandate an inerted atmosphere. The question becomes, To what extent should nitrogen be used, if at all? Nitrogen adds cost to the assembly process, the amount dependent on geography. As a result, industry has shown wide interest in decreasing consumption.