Halide-Free, Pb-Free Solder Paste

摘要

WS-820 water-soluble solder paste reportedly can print 0.012" features at both low and high relative humidity (20% to 65%), and its reflow process window handles straight ramp, short soak or long soak profiles in air. Meets IPC-7095 Class III resistance to voiding. Cleans with warm deionized water. Comes as SAC 305 and SAC 405 alloys and in Type 3 and 4 powder.