SOLDER MATERIALS PrintPlus & SolderPlus Lead-/Halide-free Pastes

摘要

These lead-free, water-soluble solder pastes pass J-STD-004A with combined halides totaling ＜0.01%. The pastes provide print definition with hot and cold slump resistance, suiting ultra-fine pitches and microBGAs. Flux residue can be removed with water wash systems. They are available in PrintPlus for stencil printing and Solder Plus for dispensing. Gap-fill properties target pin-in-hole, hermetic sealing, or attaching wires to terminals.