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The Next Leap Of Faith?

机译:信仰的下一次飞跃?

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There comes a point in every technology's lifespan where, either by necessity or mandate (i.e., legislation), evolution must occur. We've seen this with the migration from through-hole to surface mount and, of course, the recent transition to Pb-free. One such technology that emerged on the scene more than a decade ago, but never quite got its legs, is embedded passives. Not that there wasn't interest - there was (and is). A relative few leading-edge firms invested in the technology and successfully employed it, but for commercial reasons (and in some instances, patent issues), it was not implemented. Now, however, it seems there is a renewed interest in the technology, largely due to miniaturization requirements. Like SMT many years ago, it appears embedded passives may be the industry's next leap of faith.
机译:在每种技术的生命周期中都有一点,必须根据需要或授权(即立法)进行发展。从通孔到表面贴装的迁移以及最近向无铅的过渡,我们已经看到了这一点。嵌入式无源器件是一种在十多年前出现但尚未真正应用的技术。不是说没有兴趣-曾经(过去)是。相对较少的领先公司投资了该技术并成功采用了该技术,但是由于商业原因(在某些情况下还涉及专利问题),并未实施该技术。但是,现在看来,由于小型化的要求,人们对该技术有了新的兴趣。像许多年前的SMT一样,嵌入式无源器件似乎是该行业的下一个信念飞跃。

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