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Integrated circuit testing for quality assurance in manufacturing:history, current status, and future trends

机译:用于制造质量保证的集成电路测试:历史,当前状态和未来趋势

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Integrated circuit (IC) testing for quality assurance isnapproaching 50% of the manufacturing costs for some complex mixed-signalnICs. For many years the market growth and technology advancements inndigital ICs were driving the developments in testing. The increasingntrend to integrate information acquisition and digital processing on thensame chip has spawned increasing attention to the test needs ofnmixed-signal ICs. The recent advances in wireless communicationsnindicate a trend toward the integration of the RF and baseband mixednsignal technologies. In this paper we examine the developments in ICntesting from the historic, current status and future view points. Innseparate sections we address the testing developments for digital, mixednsignal and RF ICs. With these reviews as context, we relate new testnparadigms that have the potential to fundamentally alter the methodsnused to test mixed-signal and RF parts
机译:对于某些复杂的混合信号IC,用于质量保证的集成电路(IC)测试已占制造成本的50%。多年来,数字集成电路的市场增长和技术进步一直在推动测试的发展。将信息采集和数字处理集成到同一芯片上的需求日益增加,引起人们对混合信号IC测试需求的日益关注。无线通信的最新进展表明了RF和基带混合信号技术集成的趋势。在本文中,我们从历史,现状和未来的角度来考察ICntesting的发展。在不同的部分,我们讨论了数字,混合信号和RF IC的测试开发。以这些评论为背景,我们关联了新的测试范式,它们有可能从根本上改变用于测试混合信号和RF部件的方法

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