DRILL SMEAR IN HIGH ASPECT RATIO, HIGH RELIABILITY BACKPANELS: Chemical and Plasma Processing

摘要

This article evaluated the benefits in using plasma to desmear/etchback back plane panels and its ability to overcome the limitations of a wet process. Back plane panels are more frequently used in today's designs. The same plasma system can be used for standard panels and back planes―equipment changes are not required. Plasma is a dry process that does not leave residue that can contaminate a surface. Since plasma operates in a vacuum environment, only small amounts of process gas are required to achieve desmear and etchback. Unlike a wet process, plasma etches small vias with selectivity and delivers uniform repeatable results. There are no hazardous wastes produced, therefore additional environmental requirements are nonexistent. Plasma is capable of meeting the challenge of back plane designs without limitations. PCB manufacturers processing non-standard panels, such as back planes, should consider plasma as an etchback and desmear solution.