There is currently a strong demand for flex and flex-rigid PCBs (FPCs) due to the popularity of clamshell cell phones, laptops, cameras, and high-resolution screens that accompany them. The need to mass produce these panel types—and to reduce the cost of manufacture—has driven the development of newer methods of processing. Unfortunately, the materials involved when manufacturing flex and flex-rigid boards generate a large number of technical issues. One key concern is the large variance of materials in one board buildup as well as the exotic nature of some of the commonly used materials and the inherent issues they raise. We will discuss some of the differences in common materials used as well as common board build-ups and relate this to processing issues. We will provide examples for several common flex / flex-rigid board constructions, revealing some of the processing answers to the various issues raised. Lastly, we will integrate new developments in processing whilst explaining the benefits each one brings.
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