Reliability of flip chips on FR-4 assembled with reduced process steps

摘要

This paper discusses processes of flip chip on FR-4 using eutectic solder bumps with possible fewer process steps compared to the full assembly process. Some interesting results in terms of the reliability performance of flip chip on FR-4 assemblies using eutectic solder have been obtained after an almost-one-year temperature cycling test. The process steps of underfilling and curing of underfill can be omitted when a suitable epoxy is used for encapsulation.