The development of a system for measuring material deformation during the bonding of multilayer printed circuit boards

摘要

During the bonding of multi-layer printed circuit boards (PCBs) the individual layers tend to distort, causing the feature positions to move. While the results of the bonding process are well understood, the processes occurring during bonding that take place within the press are not precisely understood. In order to progress the accuracy and reliability of the process of bonding PCBs, a greater understanding of these processes is needed. This paper reports details of a project that was conceived as a way to achieve that end.