机译:多层瞬态印刷电路板的可生物降解材料
University of Illinois at Urbana-Champaign Frederick Seitz Materials Research Laboratory 104 S. Goodwin Ave Urbana, IL 61801, USA,Missouri University of Science and Technology Mechanical and Aerospace Engineering 400 West 13th Street, Rolla, MO 65409, USA;
University of Illinois at Urbana-Champaign Frederick Seitz Materials Research Laboratory 104 S. Goodwin Ave Urbana, IL 61801, USA;
University of Illinois at Urbana-Champaign Frederick Seitz Materials Research Laboratory 104 S. Goodwin Ave Urbana, IL 61801, USA;
University of Illinois at Urbana-Champaign Frederick Seitz Materials Research Laboratory 104 S. Goodwin Ave Urbana, IL 61801, USA;
University of Illinois at Urbana-Champaign Frederick Seitz Materials Research Laboratory 104 S. Goodwin Ave Urbana, IL 61801, USA;
University of Illinois at Urbana-Champaign Frederick Seitz Materials Research Laboratory 104 S. Goodwin Ave Urbana, IL 61801, USA;
University of Illinois at Urbana-Champaign Frederick Seitz Materials Research Laboratory 104 S. Goodwin Ave Urbana, IL 61801, USA;
机译:多层印刷电路板技术制造的扁平微型热管的瞬态行为建模与验证
机译:确定多层印刷电路板的组成层和铜图案层的热弹性材料性能的方法
机译:开发用于测量多层印刷电路板粘合期间材料变形的系统
机译:高速多层印刷电路板中用于电源接地线的超薄介电材料的电气性能优势
机译:多层印刷电路板布局中电磁耦合的简单高效的全波分析。
机译:集成多层可拉伸印刷电路板为可变形有源矩阵铺平了道路
机译:高密度多层印刷电路板的最新进展及对未来的讨论。利用多层印刷电路板在高级应用中的应用。用于大型计算机的低介电常数高密度多层印刷线路。
机译:多层印刷电路板材料的研究