Influences on the reflow soldering process by components with specific thermal properties

摘要

Purpose - The purpose of the paper is to focus on the research into components with specific thermal properties and their influences on the reflowrnsoldering process.rnDesign/methodology/approach - After a brief introduction, the paper gives an overview of the necessity of thermal management on printed circuitrnboards (PCBs) and the possible effects on the manufacturing of electronic devices. In the next sections, different test boards are presented forrninvestigations into different thermal effects during soldering. The last section deals with the influences of molded interconnected devices (MIDs) on thernreflow soldering process.rnFindings - The investigations show that components from the thermal management influence the reflow soldering process more or less. The highestrnimpacts on the soldering process are from components with a thermal connection to the electrical component and its solder joint. All results from therninvestigations have in common that the thermal influence can only be compensated by increasing the temperature during soldering. However,rnthis significantly increases the risk of overheating the electrical components or the PCB itself.rnResearch limitations/implications - This paper shows only the influence of some of the effects caused by thermal management on the reflowrnsoldering process. Furthermore, vapour phase soldering is not considered, but actual investigations are carried out on vapour phase soldering ovensrnas well.rnOriginality/value - Thermal management becomes more and more important with the increasing functionality of electrical components andrnelectronic devices. This topic has been the subject of a large number of articles. However, this paper deals with influences that thermal management hasrnon the soldering process during the manufacturing of the electronic device.