Device to simulate influence of different thermal expansion coefficients of printed circuit board and terminal-free component connected thereto on properties of soldered and bonded connections

摘要

In the present invention, there is disclosed a device to simulate influence of different thermal expansion coefficients of printed circuit board and terminal-free component connected thereto on properties of soldered and bonded connections, the device comprising a piezoelectric translator (6) with a cylindrical pin (7) for generating a simulated mechanical stress in connections of a terminal-free component (1) and connected with a program-controlled high-voltage source (8), and a set of exchangeable printed circuit boards (2). These printed circuit boards (2) are provided with two connecting lands (5) of different pitches for connecting a loaded terminal-free component (1). Each of these connecting lands (5) is provided with two leads (51) for connecting a device (9) for four-point measurement of a non-linearity of the current-voltage characteristic of the loaded terminal-free component (1).