Electronic device e.g. camera module, for use in a motor vehicle electronics, has padding layer adapted to thermal expansions of electronic component and printed circuit board with respect to layer`s thermal expansion-coefficient

摘要

The device has a printed circuit board (4) supporting an electronic component (2). Connecting contact units (5, 8) are provided at sides of the component and the board, respectively. A coating (10) of a weld-resisting material is provided in the board. The coating is recessed adjacent to the units (5, 8) and is arranged around the component. A padding layer (13) is adapted to thermal expansions of the component and the board with respect to a layer`s thermal expansion-coefficient and is provided in a gap (12) between the component and the board. An independent claim is also included for a method for manufacturing an electronic device.