Cu-Clad Laminate Substrates Use Halogen-Free Materials as Standard

摘要

The use of halogen-free materials in copper (Cu)-clad laminate substrates, which are the main materials of printed wiring boards (PWBs), has become established. According to the results of a survey compiled by the Japan Electronics Packaging and Circuits Association (JPCA), the production value of halogen-free materials worldwide in 2017 increased 2.6 percent from the previous year to ¥50.24 billion, and production volume decreased 29 percent on the year to 24,582,000sq.m. While phenol paper-based materials have been decreasing, the use of halogen-free materials in glass epoxy-based substrates, which are also main materials, has been advancing.