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Curvature radius measurement by optical profiler and determination of the residual stress in thin films

机译:光谱分析仪测量曲率半径和薄膜残余应力的测定

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摘要

The Stoney formula, based on the measurement of the substrate curvature, is often used for the determination of the thin films' residual stress. In this study, titanium nitride coatings were deposited by DC reactive magnetron sputtering on silicon substrates. An optical profiler was used to determine the curvature of the surface before and after coating. Two radii were then obtained, along the principal perpendicular directions of the surface curvature. A simple and efficient method to determine the experimental error on the stress calculation was developed taking into account the film thickness dispersion and the radii dispersion. Using constant deposition parameters, some samples' characteristics were tested: film and substrate thickness, size, shape and crystallographic orientations of the substrates. With the help of the developed error method, we analyzed what can be conclude about the influence of these characteristics on the calculated stress values, obtained from the experimental measurements.
机译:基于衬底曲率的测量的Stoney公式通常用于确定薄膜的残余应力。在该研究中,通过DC反应磁控溅射在硅基板上沉积氮化钛涂层。光学分析仪用于确定涂覆前后表面的曲率。然后沿着表面曲率的主垂直方向获得两个半径。考虑到膜厚度分散和半径分散,开发了一种简单富有高效的方法来确定应力计算的实验误差。使用恒定沉积参数,测试了一些样品的特性:基板的薄膜和基板厚度,尺寸,形状和晶莹剔染。在发达的误差方法的帮助下,我们分析了从实验测量获得的计算应力值对计算的应力值的影响。

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  • 来源
    《Applied Surface Science》 |2019年第1期|356-361|共6页
  • 作者单位

    Arts & Metiers ParisTech LaBoMaP Rue Porte Paris F-71250 Cluny France;

    Arts & Metiers ParisTech LaBoMaP Rue Porte Paris F-71250 Cluny France|Univ Bourgogne UMR 6303 CNRS Lab Interdisciplinaire Carnot Bourgogne ICB BP 47870 F-21078 Dijon France;

    Univ Bourgogne UMR 6303 CNRS Lab Interdisciplinaire Carnot Bourgogne ICB BP 47870 F-21078 Dijon France;

    Arts & Metiers ParisTech LaBoMaP Rue Porte Paris F-71250 Cluny France|Univ Lyon ECAM Lyon Pole Mat & Struct 40 Montee St Barthelemy F-69321 Lyon France;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Thin films; Stoney formula; Curvature measurements; Stress; Optical profiler; Error determination;

    机译:薄膜;Stoney公式;曲率测量;应力;光学分析器;错误确定;

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