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Epitaxial growth and characterization of GaN thin films on graphene/sapphire substrate by embedding a hybrid-AlN buffer layer

机译:通过嵌入杂化AlN缓冲层在石墨烯/蓝宝石衬底上外延生长和表征GaN薄膜

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This study investigates that high-quality GaN thin films can be grown on a few-layer graphene (FLG)/sapphire substrate by embedding a hybrid AlN buffer layer (BL). The hybrid AlN BL is constructed by low-temperature AlN nucleation layer (LT-AlN NL) and high-temperature AlN BL grown respectively by sputtering and metal organic chemical vapor deposition (MOCVD). The high density of edge-type threading dislocation (TD) in the GaN sample without hybrid AlN BL provide current leakage paths, resulting in a symmetric and temperature-independent I-V characteristic curve for a Ni-based Schottky contact. The excellent adhesion and uniform coverage of LT-AlN NL on the FLG layer by sputtering can overcome the nucleation issue and prevent the thermal etching effect of graphene during MOCVD epitaxial process. The edge-type TD density and carbon concentration of the GaN thin films grown on the hybrid AlN BL/FLG/sapphire substrate can be reduced significantly, resulting in a lower intensity of blue, green, and orange luminescences on a 17-K photoluminescence spectrum. The Ni-based Schottky contact with a barrier height of 0.69 eV and leakage current density of 4.38 x 10(-6) A/cm(2) is obtained, which demonstrates that a high-quality GaN thin films can be grown onto an FLG substrate by embedding a hybrid AlN BL.
机译:这项研究调查了通过嵌入混合AlN缓冲层(BL)可以在几层石墨烯(FLG)/蓝宝石衬底上生长高质量的GaN薄膜。混合AlN BL由分别通过溅射和金属有机化学气相沉积(MOCVD)生长的低温AlN成核层(LT-AlN NL)和高温AlN BL构成。没有混合AlN BL的GaN样品中的高密度边缘型穿线位错(TD)提供了电流泄漏路径,从而形成了基于镍的肖特基接触的对称且独立于温度的I-V特性曲线。 LT-AlN NL的优异附着力和溅射在FLG层上的均匀覆盖可以克服成核问题,并防止MOCVD外延过程中石墨烯的热蚀刻效果。可以显着降低混合AlN BL / FLG /蓝宝石衬底上生长的GaN薄膜的边缘型TD密度和碳浓度,从而在17-K光致发光光谱上产生较低强度的蓝色,绿色和橙色发光。获得了势垒高度为0.69 eV,漏电流密度为4.38 x 10(-6)A / cm(2)的Ni基肖特基接触,这表明可以在FLG上生长高质量的GaN薄膜。通过嵌入混合AlN BL形成衬底。

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