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Pattern design in large area using octadecyltrichlorosilane self-assembled monolayers as resist material

机译:以十八烷基三氯硅烷自组装单层为抗蚀剂材料的大面积图案设计

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摘要

Various clean complicated micro-pattern designs based on n-octadecyltrichlorosilane (OTS) self-assembled monolayer (SAM) on silicon substrates have been realized in large area by using vacuum ultraviolet (VUV) light irradiation at the wavelength of 172 nm. The degradation process of the alkylsilane SAM with irradiation time evolution has been traced by using ellipsometry, water contact angle measurement and X-ray photoelectron spectroscopy (XPS) techniques in detail. The results indicate that the SAM can be completely removed in several minutes by the irradiation of the shorter wavelength vacuum ultraviolet light. Furthermore, the ability of the OTS-SAM as resist for chemical etching has also been demonstrated. (c) 2005 Elsevier B.V. All rights reserved.
机译:通过使用波长为172 nm的真空紫外线(VUV)辐射,已在硅基板上实现了多种基于n十八烷基三氯硅烷(OTS)自组装单层(SAM)的清洁,复杂的微图案设计。通过椭圆光度法,水接触角测量和X射线光电子能谱(XPS)技术详细跟踪了烷基硅烷SAM随辐照时间演变的降解过程。结果表明,通过短波长真空紫外光的照射,可以在几分钟内完全去除SAM。此外,还已经证明了OTS-SAM作为用于化学蚀刻的抗蚀剂的能力。 (c)2005 Elsevier B.V.保留所有权利。

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