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Investigation on the barrier height and inhomogeneity of nickel silicide Schottky

机译:硅化镍肖特基的势垒高度和不均匀性研究

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The apparent Schottky barrier height (SBH) of the nickel silicide Schottky contacts annealed at different temperatures was investigated based on temperature dependence of I-V characteristic. Thermionic emission-diffusion (TED) theory, single Gaussian and double Gaussian models were employed to fit I-Vexperimental data. It is found the single Gaussian and double Gaussian SB distribution model can give a very good fit to the I-V characteristic of apparent SBH for different annealing temperatures. Also, the apparent SBH and the leakage current increase with annealing temperatures under reverse voltage. In addition, the homogeneity of interfaces for the samples annealed at temperatures of 500 and 600 degrees C is much better than that of the samples annealed at temperatures of 400, 700, and 800 degrees C. This may result from the phase transformation of nickel silicide due to the different annealing temperatures and from the low Schottky barrier (SB) patches. (c) 2005 Elsevier B.V. All rights reserved.
机译:基于I-V特性对温度的依赖性,研究了在不同温度下退火的硅化镍肖特基接触的表观肖特基势垒高度(SBH)。使用热电子发射-扩散(TED)理论,单高斯模型和双高斯模型来拟合I-V实验数据。发现单高斯和双高斯SB分布模型可以很好地拟合不同退火温度下表观SBH的I-V特性。同样,在反向电压下,表观SBH和漏电流会随着退火温度的增加而增加。此外,在500和600摄氏度温度下退火的样品的界面均匀性比在400、700和800摄氏度温度下退火的样品的界面均匀性好得多。这可能是由于硅化镍的相变导致的由于退火温度不同以及肖特基势垒(SB)低而导致的。 (c)2005 Elsevier B.V.保留所有权利。

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