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Electrochemical investigation of the surface energy: Effect of the HF concentration on electroless silver deposition onto p-Si (1 1 1)

机译:表面能的电化学研究:HF浓度对化学硅沉积在p-Si上的影响(1 1 1)

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Electroless silver deposition onto p-silicon (1 1 1) from 0.005 mol 1~(-1) AgNO_3 solutions with different HF concentration was investigated by using an electrochemical direct current polarization method and open circuit potential-time (Ocp-t) technique. The fact that three-dimensional (3D) growth of silver onto silicon is favored with increasing the HF concentration was ascribed to the drop of the surface energy and approved by electrochemical direct current polarization, Ocp-t technique and atomic force microscopy (AFM). The drop slope of open-circuit potential, K_(-ΔE(OCP)/t), was educed from the mixed-potential theory. K_(-ΔE(OCP)/t) as well as the deposition rate determined by an inductively coupled plasma atomic emission spectrometry (ICP-AES), increased with the HF concentration, yet was not a linear function. Results were explained by the stress generation and relaxation mechanisms.
机译:采用电化学直流极化法和开路电势-时间(Ocp-t)技术研究了不同HF浓度的0.005 mol 1〜(-1)AgNO_3溶液在p-硅(1 1 1)上的化学沉积。银在硅上的三维(3D)生长与增加HF浓度有关的事实归因于表面能的下降,并得到电化学直流极化,Ocp-t技术和原子力显微镜(AFM)的认可。开路电势的下降斜率K _(-ΔE(OCP)/ t)由混合电势理论得出。 K _(-ΔE(OCP)/ t)以及通过电感耦合等离子体原子发射光谱法(ICP-AES)确定的沉积速率随HF浓度的增加而增加,但不是线性函数。结果由应力产生和松弛机制解释。

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