Bath and method for electroless deposition of silver on metal surfaces

摘要

Existing methods of improving the solderability of metal surfaces, in particular copper surfaces on printed circuit boards, suffer from the disadvantage that either unevenly thick cover layers are formed on the metal surfaces, that these layers are very expensive, or that environmentally harmful components are used to produce them. In addition, the metal surfaces should also be suitable for forming bond connections and electrical contacts. To solve these problems, a bath and a method for the electroless deposition of silver on metal surfaces that are less noble than silver by charge exchange reaction, in particular on copper, are described, which contain at least one silver halo complex, but not a reducing agent for Ag + + ions.