机译:衬底性能和热退火对氮化钽薄膜的影响
Chair of Micromechanics, Microfluidics/Microactuators, Saarland University, 66123 Saarbruecken, Germany;
Chair of Micromechanics, Microfluidics/Microactuators, Saarland University, 66123 Saarbruecken, Germany;
Chair of Micromechanics, Microfluidics/Microactuators, Saarland University, 66123 Saarbruecken, Germany;
Friedrich-Alexander-University Erlangen-Nuremberg, Martensstr. 5, D-91058 Erlangen, Germany;
Friedrich-Alexander-University Erlangen-Nuremberg, Martensstr. 5, D-91058 Erlangen, Germany;
Department for Microsystems Technology, Institute of Sensor and Actuator Systems, Vienna University of Technology, Floragasse 7, 1040 Vienna, Austria;
tantalum nitride; thin films magnetron sputtering; microstructure; thermal annealing; LTCC; SiO_2; resistivity;
机译:退火温度对直流溅射技术沉积在SiO_2 / Si衬底上的氮化钽薄膜电阻器结构和电性能的影响
机译:膜厚对II型衰减器应用在SiO2 / Si衬底上沉积的氮化钽薄膜电学性能的影响
机译:二氧化硅基质化学性质对原子层沉积所沉积氮化钽薄膜的影响:微观结构,化学性质和电学行为
机译:用OCVD法在OTS图案的SI(100)衬底上选择氮化钽和氮化HA薄膜的选择性生长
机译:氢退火和衬底温度对射频溅射氧化锌薄膜性能的影响
机译:Si(100)衬底上CO40FE40W20薄膜磁性和结构退火的影响
机译:热退火对蓝宝石薄铝膜结构和光学性质的影响
机译:(111)pt基底上快速热退火锆钛酸铅薄膜的取向