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Simultaneous double-sided deposition of HTS films on 3-inch wafers by ICM-sputtering

机译:通过ICM溅射在3英寸晶圆上同时双面沉积HTS膜

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The construction of a system which allows simultaneous deposition of HTS films on both sides of 3-inch wafers is described. The wafers are placed in a heating cavity which can be heated to 1000/spl deg/C. Deposition is accomplished through two opposite holes in the cavity by inverted cylindrical magnetron (ICM) sputtering guns. YBaCuO films deposited on 3 inch CeO/sub 2/ buffered sapphire substrates revealed a growth quality and T/sub c/ and j/sub c/ values comparable to standard films with sufficient uniformity on both sides of the wafer. The surface resistance of the films measured in the frequency range of 2.68 to 145 GHz is 20 m/spl Omega/ at the highest frequency.
机译:描述了允许在3英寸晶片的两面同时沉积HTS膜的系统的结构。将晶片放置在可以加热到1000 / spl deg / C的加热腔中。沉积是通过倒置的圆柱形磁控管(ICM)喷枪在型腔中的两个相对孔完成的。沉积在3英寸CeO / sub 2 /蓝宝石缓冲衬底上的YBaCuO薄膜的生长质量和T / sub c /和j / sub c /值可与晶圆两侧均具有足够均匀性的标准膜相媲美。在2.68至145 GHz频率范围内测得的薄膜的表面电阻在最高频率下为20 m / spl Omega /。

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