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Thermal stability and electronic structures of N-doped SiSb films for high temperature applications of phase-change memory

机译:用于相变存储器高温应用的N掺杂SiSb薄膜的热稳定性和电子结构

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Undoped and N-doped Si_(10.5)Sb_(89.5) films were deposited by magnetron sputtering. The X-ray diffraction spectra indicated that all of the films crystallized into crystalline Sb with a rhombohedral structure after annealing at 280℃for 3 min. X-ray photoelectron spectroscopy analysis indicated that the incorporated nitrogen combined with Si to form silicon nitride in the SiSb films. The changes in electrical resistance and thermal stability of the undoped and N-doped Si_(10.5)Sb_(89.5_ films were investigated. The crystallization temperature increased from ~225℃ to ~250℃ when 13 at.% nitrogen was added into the Si_(10.5)Sb_(89.5) film and increased further with increasing nitrogen content. The thermal stability of the amorphous film was enhanced by nitrogen doping. The maximum temperature for 10-year retention of amorphous state of a pure Si_(10.5)Sb_(89.5) film is ~140℃ and the temperature of N-doped Si_(10.5)Sb_(89.5) films is even higher, which may be helpful to improve the data retention and performance of phase-change memory in high temperature applications.
机译:通过磁控溅射沉积未掺杂和N掺杂的Si_(10.5)Sb_(89.5)膜。 X射线衍射光谱表明,所有薄膜在280℃退火3min后均结晶成具有菱形结构的Sb晶体。 X射线光电子能谱分析表明,掺入的氮与Si结合形成SiSb膜中的氮化硅。研究了未掺杂和N掺杂的Si_(10.5)Sb_(89.5_)薄膜的电阻和热稳定性的变化,当向Si_中添加13 at。%的氮时,结晶温度从〜225℃升高至〜250℃。 (10.5)Sb_(89.5)薄膜随着氮含量的增加而进一步增加,通过氮掺杂提高了非晶态薄膜的热稳定性,纯Si_(10.5)Sb_(89.5)非晶态保持10年的最高温度。 )薄膜温度约为140℃,而N掺杂的Si_(10.5)Sb_(89.5)薄膜的温度甚至更高,这可能有助于改善高温应用中的相变存储器的数据保留和性能。

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