首页> 外文期刊>Applied Physics >A dual-curable transfer layer for adhesion enhancement of a multilayer UV-curable nanoimprint resist system
【24h】

A dual-curable transfer layer for adhesion enhancement of a multilayer UV-curable nanoimprint resist system

机译:用于增强多层可紫外固化纳米压印光刻胶系统粘合力的双可固化转印层

获取原文
获取原文并翻译 | 示例
           

摘要

We invented a dual-curable transfer layer to en-hance adhesion of the UV-curable nanoimprint resist to the substrate. Based on this transfer layer, we developed bilayer resist and trilayer resist UV-curable nanoimprint lithogra-phy processes, which were used for etching and lift-off pro-cesses, respectively. The dual-curable transfer layer com-bined at least two different types of reactive functions based on different polymerization mechanisms. It formed strong chemical bonds with both the underneath material and the nanoimprint resist layer in two curing steps. It helped im-prove the adhesion of the low surface energy resist film to the substrate substantially, and, more importantly, made high-resolution patterning much more reliable. Moreover, low aspect ratio imprinted patterns were amplified into high aspect ratio patterns through the transfer layer via a selective etching process.
机译:我们发明了一种双重可固化的转移层,以增强紫外线可固化的纳米压印抗蚀剂对基材的附着力。在此转移层的基础上,我们开发了双层抗蚀剂和三层抗蚀剂可紫外固化的纳米压印光刻技术,分别用于蚀刻和剥离工艺。基于不同的聚合机理,双固化的转移层结合了至少两种不同类型的反应性官能团。在两个固化步骤中,它与下面的材料和纳米压印抗蚀剂层均形成了牢固的化学键。它有助于显着改善低表面能抗蚀剂膜与基材的粘合性,更重要的是,高分辨率图案的可靠性更高。此外,通过选择性蚀刻工艺,通过转印层将低纵横比的压印图案放大为高纵横比的图案。

著录项

  • 来源
    《Applied Physics》 |2012年第1期|p.1-6|共6页
  • 作者单位

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Nanjing University,Nanjing 210093, P.R. China;

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Nanjing University,Nanjing 210093, P.R. China;

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Nanjing University,Nanjing 210093, P.R. China;

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Nanjing University,Nanjing 210093, P.R. China;

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Nanjing University,Nanjing 210093, P.R. China;

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Nanjing University,Nanjing 210093, P.R. China;

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Nanjing University,Nanjing 210093, P.R. China;

    Department of Electrical Engineering, University of Southern California, 3737 Watt Way, Los Angeles, CA 900089, USA;

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Nanjing University,Nanjing 210093, P.R. China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号