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Temperature-dependent capacitance-voltage analysis of defects in Al2O3 gate dielectric stacks on GaN

机译:GaN上Al2O3栅介质堆叠中缺陷的随温度变化的电容电压分析

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摘要

Capacitance-voltage measurements of Pd/atomic layer deposited Al2O3/GaN metal oxide semiconductor capacitors performed over a temperature range of 77 K-500 K are reported. Border trap response is not detected in these measurements, consistent with the energy levels of bulk Al2O3 defects predicted in reported first principles calculations. The limitations of the conductance method for estimation of the interface state density of the wide band gap GaN semiconductor, even at a measurement temperature of 500 K, are discussed. As GaN-based devices are intended for high temperature applications, the role of the pyroelectric effect in the interpretation of higher-temperature capacitance-voltage data is described.
机译:报告了在77 K-500 K的温度范围内执行的Pd /原子层沉积的Al2O3 / GaN金属氧化物半导体电容器的电容电压测量。在这些测量中未检测到边界陷阱响应,这与已报道的第一性原理计算中预测的大量Al2O3缺陷的能级一致。讨论了即使在500 K的测量温度下,用于估算宽带隙GaN半导体的界面态密度的电导方法的局限性。由于GaN基器件旨在用于高温应用,因此描述了热电效应在解释高温电容-电压数据中的作用。

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