High-throughput bend-strengths of ultra-small polysilicon MEMS components

摘要

The strength distribution of polysilicon bend specimens,approximately 10 μm in size,is measured using a high-throughput microelectrome-chanical system fabrication and testing method. The distribution is predicted from reference tests on tensile specimens and finite element analysis of the bend specimen geometry incorporated into a stochastic extreme-value strength framework. Agreement between experiment and prediction suggests that the ultra-small specimens may be at the limit of extreme-value scaling and contain only one strength-controlling flaw/specimen.