机译:hBN封装的石墨烯可实现高温电子设备
Univ Manchester, Sch Phys & Astron, Manchester M13 9PL, Lancs, England;
Univ Manchester, Sch Phys & Astron, Manchester M13 9PL, Lancs, England;
Univ Manchester, Natl Graphene Inst, Manchester M13 9PL, Lancs, England;
Univ Manchester, Sch Phys & Astron, Manchester M13 9PL, Lancs, England;
Natl Inst Mat Sci, 1-1 Namiki, Tsukuba, Ibaraki 3050044, Japan;
Natl Inst Mat Sci, 1-1 Namiki, Tsukuba, Ibaraki 3050044, Japan;
Univ Manchester, Natl Graphene Inst, Manchester M13 9PL, Lancs, England|Natl Res Univ Higher Sch Econ, Dept Phys, Staraya Basmannaya 21-4, Moscow 105066, Russia;
Univ Manchester, Sch Phys & Astron, Manchester M13 9PL, Lancs, England|Univ Manchester, Natl Graphene Inst, Manchester M13 9PL, Lancs, England;
Univ Manchester, Sch Phys & Astron, Manchester M13 9PL, Lancs, England|Univ Manchester, Natl Graphene Inst, Manchester M13 9PL, Lancs, England;
机译:在HBN封装石墨烯电子设备中的原位应变调谐
机译:在HBN封装石墨烯电子设备中的原位应变调谐
机译:石墨烯衬底上的GaN微棒可实现可弯曲的光电器件
机译:通过受控分子掺杂石墨烯实现的高速石墨烯光电器件
机译:用于高温(500摄氏度)操作的6H碳化硅和4H碳化硅电子器件的处理和表征。
机译:快速模板掩膜制造实现了一步式无聚合物石墨烯图案化和柔性石墨烯器件的直接转移
机译:高温电子设备由HBN封装的石墨烯启用