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Chemical states and electrical properties of a high-K metal oxide/silicon interface with oxygen-gettering titanium-metal-overlayer

机译:具有吸氧性的钛金属覆盖层的高K金属氧化物/硅界面的化学态和电性能

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The authors report on the chemical bonding structure of the HfO_2/Si (001) stack after the SiO_2 interfacial layer (IL) is partially removed by a reactive titanium metal overlayer. Using synchrotron photoelectron spectroscopy, they found that ultrathin SiO_2-like IL ~6.5 A thick, which is significantly less than the initial SiO_2 IL thickness of ~15 A, exists at the HfO_2/Si interface with an overlying Ti electrode. The dissociated Si from SiO_2 IL is believed to go onto Si substrate where it regrows epitaxially. The interfacial trap density of the Ti-electrode sample was extracted to be ~1.6 X 10~(11) eV~(-1) cm~(-2) near the midgap of Si, which was comparable to that of the control sample with W electrode.
机译:作者报告了通过活性钛金属覆盖层部分去除SiO_2界面层(IL)后HfO_2 / Si(001)堆栈的化学键结构。使用同步加速器光电子光谱法,他们发现在与Ti电极重叠的HfO_2 / Si界面上存在厚度SiO2类IL的厚约6.5 A,远小于SiO 2 IL的初始厚度约15A。据信从SiO_2 IL中解离的Si进入Si衬底上,在那里外延长大。 Ti电极样品的界面陷阱密度被提取为在Si的中间能隙附近〜1.6 X 10〜(11)eV〜(-1)cm〜(-2),这与对照样品的界面陷阱密度相当。 W电极。

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