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Lateral epitaxial overgrowth of aluminum nitride on patterned silicon carbide substrates by hydride vapor phase epitaxy

机译:氢化物气相外延在图案化碳化硅衬底上氮化铝的横向外延过度生长

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This letter reports on the reduction of threading dislocation densities in AlN films via lateral epitaxial overgrowth by hydride vapor phase epitaxy. A variety of different stripe patterns were used to produce fully coalesced AlN films. Transmission electron microscopy (TEM) was used to assess the structural quality of these films. TEM determined that the dislocation density in the laterally grown wing regions was less than 8.3 x 10~6 cm~(-2) as compared to 1.8 x 10~9 cm~(-2) in the seed regions. Atomic force microscopy revealed that the films have a smooth surface morphology with a rms roughness of 0.71 nm over 10 x 10 μm~2 sampling areas.
机译:这封信报道了氢化物气相外延通过横向外延过度生长而降低了AlN膜中的螺纹位错密度。各种不同的条纹图案用于生产完全聚结的AlN薄膜。透射电子显微镜(TEM)用于评估这些薄膜的结构质量。透射电镜(TEM)确定了在侧翼生长的翅膀区域中的位错密度小于8.3 x 10〜6 cm〜(-2),而种子区域中的位错密度为1.8 x 10〜9 cm〜(-2)。原子力显微镜显示,该膜具有光滑的表面形态,在10 x 10μm〜2的采样区域内,均方根粗糙度为0.71 nm。

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