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Influence of metal capping layer on the work function of Mo gated metal-oxide semiconductor stacks

机译:金属覆盖层对钼栅极金属氧化物半导体叠层功函数的影响

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It was found that applying a capping layer has an important impact on the work function (WF) of Mo gated metal-oxide semiconductor stacks. Before any postmanufacturing thermal treatment, uncapped Mo has a similar WF as one capped with a TaC layer. However, after forming gas anneal (FGA), the uncapped Mo gate exhibits a significantly higher WF than the TaC capped one does. This is understood as O incorporation during deposition, storage or FGA, and its subsequent piling up at the Mo/dielectric interface during FGA in the former case, which is an effect prevented by TaC capping.
机译:已经发现,施加覆盖层对Mo栅极金属氧化物半导体叠层的功函数(WF)具有重要影响。在任何制造后热处理之前,未封端的Mo的WF与覆盖TaC层的WF相似。但是,在形成气体退火(FGA)之后,未封盖的Mo栅极的WF显着高于被TaC封盖的Mo栅极的WF。这被理解为在沉积,存储或FGA期间的O掺入,在前一种情况下,其随后在FGA期间在Mo /电介质界面处堆积,这是通过TaC封盖防止的。

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