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Anomalous positive-bias temperature instability of high-κ/metal gate devices with Dy_2O_3 capping

机译:Dy_2O_3封盖的高κ/金属栅器件的正温度异常失稳

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摘要

Substantial V_t modulation of 150-220 mV in n-type metal-oxide-semiconductor devices without mobility degradation is possible by inserting a 1 nm Dy_2O_3 cap between the HfSiON and TaN metal gate. However, in the Dy_2O_3-capped devices we observe an anomalous positive-bias temperature instability behavior where the threshold voltage (V_t) decreases substantially during the electrical stress and eventually saturates. The stress polarity effect, the strong temperature dependence, full recovery, and the response to hot carriers suggest that two competing physical mechanisms are responsible for the V_t behavior-diffusion of preexisting positively charged species dominating at high temperature and electron trapping dominating at low temperature. The charged species are likely located in the mixed high-κ dielectric and associated with the interaction between the host dielectric, cap, and metal gate.
机译:通过在HfSiON和TaN金属栅极之间插入1 nm Dy_2O_3帽,可以在n型金属氧化物半导体器件中实现150-220 mV的V_t调制,而不会造成迁移率降低。但是,在Dy_2O_3封顶的器件中,我们观察到异常的正偏压温度不稳定性行为,其中阈值电压(V_t)在电应力期间显着降低并最终饱和。应力极性效应,强烈的温度依赖性,完全恢复以及对热载流子的响应表明,两个相互竞争的物理机制是导致高温下占优势的预先存在的带正电物质的扩散和低温下占主导的电子俘获的V_t行为扩散的原因。带电物质可能位于混合的高κ电介质中,并与主体电介质,顶盖和金属栅极之间的相互作用有关。

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