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首页> 外文期刊>Applied Physicsletters >Electrical stress-induced instability of amorphous indium-gallium-zinc oxide thin-film transistors under bipolar ac stress
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Electrical stress-induced instability of amorphous indium-gallium-zinc oxide thin-film transistors under bipolar ac stress

机译:在双极交流应力下电应力引起的非晶铟镓锌氧化物薄膜晶体管的不稳定性

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摘要

Bipolar ac stress-induced instability of amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors is comparatively investigated with that under a positive dc gate bias stress. While the positive dc gate bias stress-induced threshold voltage shift (△V_T) is caused by the charge trapping into the interface/gate dielectric as reported in previous works, the dominant mechanism of the ac stress-induced △V_T is observed to be due to the increase in the acceptorlike deep states of the density of states (DOS) in the a-IGZO active layer. Furthermore, it is found that the variation of deep states in the DOS makes a parallel shift in the I_(DS)-V_(GS) curve with an insignificant change in the subthreshold slope, as well as the deformation of the C_G-V_G curves.
机译:与双极性交流应力引起的非晶铟镓锌氧化物(a-IGZO)薄膜晶体管的不稳定性相比,在正直流栅极偏置应力下进行了比较。正如先前工作中报道的那样,正直流栅极偏置应力引起的阈值电压偏移(△V_T)是由电荷俘获到界面/栅极电介质中引起的,但观察到交流应力引起的△V_T的主要机理是由于导致a-IGZO有源层中态密度(DOS)的受体样深态的增加。此外,发现DOS中深状态的变化使I_(DS)-V_(GS)曲线发生平行移动,而亚阈值斜率无明显变化,并且C_G-V_G曲线发生了变形。 。

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  • 来源
    《Applied Physicsletters》 |2009年第13期|132101.1-132101.3|共3页
  • 作者单位

    School of Electrical Engineering, Kookmin University, 861-1 Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Republic of Korea;

    School of Electrical Engineering, Kookmin University, 861-1 Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Republic of Korea;

    School of Electrical Engineering, Kookmin University, 861-1 Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Republic of Korea;

    School of Electrical Engineering, Kookmin University, 861-1 Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Republic of Korea;

    School of Electrical Engineering, Kookmin University, 861-1 Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Republic of Korea;

    School of Electrical Engineering, Kookmin University, 861-1 Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Republic of Korea;

    School of Electrical Engineering, Kookmin University, 861-1 Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Republic of Korea;

    Semiconductor Laboratory, Samsung Advanced Institute of Technology, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do 446-712, Republic of Korea;

    Semiconductor Laboratory, Samsung Advanced Institute of Technology, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do 446-712, Republic of Korea;

    Semiconductor Laboratory, Samsung Advanced Institute of Technology, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do 446-712, Republic of Korea;

    Semiconductor Laboratory, Samsung Advanced Institute of Technology, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do 446-712, Republic of Korea;

    Semiconductor Laboratory, Samsung Advanced Institute of Technology, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do 446-712, Republic of Korea;

    Semiconductor Laboratory, Samsung Advanced Institute of Technology, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do 446-712, Republic of Korea;

    Semiconductor Laboratory, Samsung Advanced Institute of Technology, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do 446-712, Republic of Korea;

    Semiconductor Laboratory, Samsung Advanced Institute of Technology, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do 446-712, Republic of Korea;

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