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Low temperature sintering of Ag nanoparticles for flexible electronics packaging

机译：Ag纳米粒子的低温烧结，用于柔性电子封装

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摘要

We achieve robust bonding of Cu wires to Cu pads on polyimide with silver nanopaste cured at 373 K. The paste is prepared by simply condensing Ag nanoparticle (NP) solution via centrifuging. The bonding is formed by solid state sintering of Ag NPs through neck growth and direct metallic bonding between clean Ag-Cu interfaces. Both experiment and Monte Carlo simulation confirm that the melting point of joint clusters increases during sintering. This creates improved bonds for use at an elevated operating temperature using Ag NPs.
机译：通过在373 K下固化的银纳米浆料，我们实现了铜线与聚酰亚胺上的铜焊盘的牢固结合。通过离心将银纳米粒子（NP）溶液简单浓缩即可制得该浆料。结合是通过颈部生长对Ag NP进行固态烧结以及在干净的Ag-Cu界面之间直接进行金属结合而形成的。实验和蒙特卡洛模拟均证实，在烧结过程中，接头簇的熔点增加。这将产生改进的键合，以便在使用Ag NP的较高操作温度下使用。

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  • 来源
    《Applied Physics Letters》 |2010年第15期|p.153117.1-153117.3|共3页
  • 作者

    A. Hu; J. Y. Guo; H. Alarifi; G. Patane; Y. Zhou; G. Compagnini; C. X. Xu;

  • 作者单位

    Department of Mechanical and Mechatronics Engineering, Centre for Advanced Material Joining,University of Waterloo, 200 University Avenue West, Waterloo, Ontario N2L 3G1, Canada;

    rnState Key Laboratory of Bioelectronics, Advanced Photonics Center, Southeast University, Nanjing 210096,People's Republic of China;

    rnDepartment of Mechanical and Mechatronics Engineering, Centre for Advanced Material Joining,University of Waterloo, 200 University Avenue West, Waterloo, Ontario N2L 3G1, Canada;

    rnDipartimento di Scienze Chimiche, University di Catania, Viale A. Doria 6, Catania 95125, Italy;

    rnDepartment of Mechanical and Mechatronics Engineering, Centre for Advanced Material Joining,University of Waterloo, 200 University Avenue West, Waterloo, Ontario N2L 3G1, Canada;

    rnDipartimento di Scienze Chimiche, University di Catania, Viale A. Doria 6, Catania 95125, Italy;

    rnState Key Laboratory of Bioelectronics, Advanced Photonics Center, Southeast University, Nanjing 210096,People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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