机译:位错密度对交流电操作的InGaN / GaN发光二极管中载流子注入的影响
Chip Development Team (LED), Samsung Electronics, Yongin 446-711, South Korea;
Chip Development Team (LED), Samsung Electronics, Yongin 446-711, South Korea;
Chip Development Team (LED), Samsung Electronics, Yongin 446-711, South Korea;
Chip Development Team (LED), Samsung Electronics, Yongin 446-711, South Korea;
Chip Development Team (LED), Samsung Electronics, Yongin 446-711, South Korea;
Chip Development Team (LED), Samsung Electronics, Yongin 446-711, South Korea;
Chip Development Team (LED), Samsung Electronics, Yongin 446-711, South Korea;
Department of Nano Systems Engineering, Center for Nano Manufacturing, lnje University,Gimhae 621-749, South Korea;
机译:位错密度对交流电操作的InGaN / GaN发光二极管中载流子注入的影响
机译:温度对基于InGaN / GaN多量子阱的发光二极管中载流子注入机理的影响
机译:包含GaN / AlGaN / GaN三角势垒的InGaN发光二极管中的载流子注入和约束得到改善
机译:降低低位错密度GaN衬底上InGaN发光二极管的效率下降
机译:以极性,半极性和非极性方向生长的InGaN / GaN多量子阱发光二极管。
机译:非极性m面InGaN / GaN发光二极管的有效载流子注入传输弛豫和复合与更强的载流子定位和低极化效应相关
机译:具有p-GaN / n-GaN / p-GaN / n-GaN / p-GaN电流扩散层的改进型InGaN / GaN发光二极管